Application directions of aluminum nitride ceramics
2026-03-24
Application directions of aluminum nitride ceramics
1、 Application of Aluminum Nitride in Filler Packaging
Aluminum nitride can be used in TIM (thermal interface material). By adding high thermal conductivity insulating aluminum nitride particles to epoxy resin, the thermal conductivity and strength of the material can be effectively improved; It can also be used as a thermal conductive adhesive, thermal grease, etc. It is widely used as a heat transfer medium in electronic devices, such as filling gaps between CPUs and heat sinks, and as a heat transfer medium at the fine seams where high-power transistors and thyristors come into contact with substrates. Aluminum nitride powder has broad application prospects in high-performance fields such as electronics, metallurgy, chemical engineering, and functional ceramics. It can be used as integrated circuit substrates, electronic packaging materials, heat sinks, piezoelectric components, crucible materials for molten metals, as well as reinforcing and modifying agents for composite materials.
2、 Application of Aluminum Nitride in IGBT
Aluminum nitride functional ceramic copper-clad laminate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, low expansion of ceramics, as well as the high conductivity and excellent welding performance of oxygen free copper, making it a key basic material for IGBT module packaging. Copper coated ceramic substrate (DBC), also known as copper-clad ceramic or ceramic board, refers to an electronic base material made by using DCB (Direct Copper Bond) technology to coat copper foil on the surface of ceramics. Aluminum nitride powder is suitable as a heat dissipation material for high-power devices and integrated circuits; Aluminum nitride powder has a low coefficient of thermal expansion and can be well matched with silicon, making it suitable as a substrate material for semiconductor devices; The high mechanical strength and melting point of aluminum nitride powder can be used as an additive and reinforcement for composite materials.
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